Samsung Electronics Develops Industry's Highest-Capacity Memory Chip, HBM3E 12H, for AI Applications

samsung electronics unveils a new high-bandwidth memory chip

hbm3e 12h chip features

The HBM3E 12H chip boasts the industry's highest capacity and increased performance by over 50%. It is designed to meet the growing demand for high-capacity HBM in AI services. Samsung plans to begin mass production in the first half of 2024 after initiating customer sampling.

samsung's leadership in the high-capacity hbm market

The company's efforts in developing core technologies for high-stack HBM aim to provide leadership in the high-capacity HBM market in the AI era. According to SK Kim, executive director of Daiwa Securities, this news is likely to have a positive impact on Samsung's share price.